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Bookmark or Share- Thermal management materials | Henkel AdhesivesHenkel’s LOCTITE ® Bergquist ® thermal management materials, including GAP PAD ® materials, SIL PAD ® materials, phase change materials, microTIMs, LIQUI-FORM ® products, and thermal adhesives, tackle today’s toughest thermal management challenges. Manage heat more effectively every step of the way with a thermal management material ...
- Thermal GAP PAD materials | Henkel AdhesivesBergquist ® GAP PAD ® products are suitable for many electrical applications. Browse the full portfolio of materials to find the right product for your thermal management pad needs. From super soft to harder silicone-free options for a range of applications, find the right gap filler pads for any task with the range of Bergquist ® thermal ...
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- BERGQUIST® GAP PAD® TGP 5000 | Henkel AdhesivesBERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components.
- BERGQUIST® GAP PAD TGP 3500ULM - Henkel AdhesivesA thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM). BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during ...
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